Subject: Time: 1:08 PM
FAB: Date: 7/25/97
Hi:
I am looking for photoresist can survive the direct plating process (PH=1~2
and =10~11 during operation steps) or E-less plating process. In the other
words, Is it possible to selectively plate copper by using direct plating or
e-less plating.(I know this approach sounds un-usual)
Thanks for suggestion.
Bill Chou
Fujitsu Computer Packaging Technologies,Inc.
[log in to unmask]
(408)943-7721
fax: (408)943-7790
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