Concerning the 2.0 microgram/sq. in. limit:
Mark Shireman of Alliant Techsystems just presented a paper at China
Lake about a military low residue soldering production process. Based
on their experience, he recommends a bare board limit of < 2.0
micrograms/sq.in. for most designs. The data was generated using an
Omegameter 600SMD, 10 minute cycle, unheated. I think the limit
originated from a study conducted for the Army by Contamination Studies
Laboratory.
Mary Davis
Hughes Aircraft
Naval & Maritime Systems
206-356-3311
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