Concerning the 2.0 microgram/sq. in. limit: Mark Shireman of Alliant Techsystems just presented a paper at China Lake about a military low residue soldering production process. Based on their experience, he recommends a bare board limit of < 2.0 micrograms/sq.in. for most designs. The data was generated using an Omegameter 600SMD, 10 minute cycle, unheated. I think the limit originated from a study conducted for the Army by Contamination Studies Laboratory. Mary Davis Hughes Aircraft Naval & Maritime Systems 206-356-3311 [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************