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Date: | Thu, 20 Feb 1997 17:11:35 +0300 |
Content-Type: | text/plain |
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Hi all,
There is something for testing people :
In our assembly, we use multilayer FR 4 boards. Earlier the smd process
consists of:
-Paste printing
-Component placement ( SMD )
-Reflow
-Placement of through-hole components
-Wavesoldering, which solders naturally all vias, too
In order to streamline the process, we have a target to get rid of
through hole components and
wavesoldering through using only SMD-components.
Anyway, now a question has been risen that argues that IC-testing will not
be any more reliable, because the tip
of a probe pin does not directly touch the surface of solder in via.
The diameter of vias is usually 0.5 mm ( 0.02" ) with annular ring of 0.15
mm ( 0.005" )
So, has anyone something to comment/experience on the question out there?
Regards,
[log in to unmask]
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