Hi   all,

 There is something for testing people :
In our assembly, we use multilayer FR 4 boards. Earlier the smd process
consists of:
          -Paste printing
          -Component placement ( SMD )
          -Reflow
          -Placement of through-hole components
          -Wavesoldering, which solders naturally all vias, too
In order to streamline  the process, we have a target  to get rid of
through hole components and
wavesoldering through using only SMD-components.
Anyway, now a question has been risen that argues that  IC-testing will not
be any more reliable, because the tip
of a probe pin does not directly touch the surface of solder in via.
The diameter of vias is usually  0.5 mm ( 0.02" ) with annular ring of 0.15
mm (  0.005" )

So, has anyone something to comment/experience on the question out there?

Regards,
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