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January 1997

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Subject:
ASSY: Solder Paste Process Control
From:
[log in to unmask] (Jack Crawford)
Date:
Wed, 22 Jan 1997 09:00:30 -0500
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Periodically there are requests for information about assessing and
monitoring solder paste in the manufacturing environment to minimize defect
potential.  Marquette University and the EMPF are presenting a seminar in
Anaheim during NEPCON (Solder Paste Process Control Using AC Electricial
Techniques) to share the results of several years of research with data
collected from several beta test sites.

Contact Dr. Martin Seitz (414) 288-5659 or the EMPF HelpLine directly
(separate from this forum) for more information.

***ALL NEW EMPF PHONE NUMBERS***

Jack Crawford, HelpLine Coordinator
Electronics Mfg. Productivity Facility
****NEW--317.655.3688
****FAX  317-655-3699
714 N Senate Ave, Suite 100
Indianapolis IN  46202-3112
VISIT OUR HOME PAGE AT: http://www.empf.org
[log in to unmask]


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