Following from EMPF IPC-A-610 Master Instructor Linda Zellars:

>J-STD-001B specifies under para.9.2.1.1 When the outer, lower edge of land
>areas are lifted or separated more than the thickness (height) of the land
>the printed wiring board must be rejected.  This also means that if it is
>lifted less than the thickness of the land it is acceptable.
>
For more info, contact the EMPF directly at the address in the signature
file at the end of this msg.
>
>At 03:27 PM 1/14/97 -0500, you wrote:
>>>Resent-Date: Tue, 14 Jan 1997 03:05:53 -0800
>>>Resent-Sender: [log in to unmask]
>>>Old-Return-Path: <[log in to unmask]>
>>>Date: Tue, 14 Jan 1997 10:52:18 +0200 (IST)
>>>From: Yakov Steinberg <[log in to unmask]>
>>>To: [log in to unmask]
>>>Subject: lifed pads
>>>Resent-From: [log in to unmask]
>>>X-Mailing-List: <[log in to unmask]> archive/latest/9179
>>>X-Loop: [log in to unmask]
>>>Precedence: list
>>>Resent-Sender: [log in to unmask]
>>>
>>>Fellow Technetters:
>>>
>>>What is the "rule" regarding lifted pads on multilayer boards?  We have
>>>always scrapped them.  A subcontractor recently returned a few of our
>>>boards which had lifted pads.  We follow IPC-A-610B class II.  The subject
>>>is not mentioned.
>>>
>>>
>>>Comments are appreciated.
>>>
>>>Ellen Berkman
>>>Excalibur Systems

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