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Tue, 14 Jan 1997 15:43:45 -0500 |
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| From [log in to unmask] Tue Jan 14 16: |
29:02 1997 |
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Following from EMPF IPC-A-610 Master Instructor Linda Zellars:
>J-STD-001B specifies under para.9.2.1.1 When the outer, lower edge of land
>areas are lifted or separated more than the thickness (height) of the land
>the printed wiring board must be rejected. This also means that if it is
>lifted less than the thickness of the land it is acceptable.
>
For more info, contact the EMPF directly at the address in the signature
file at the end of this msg.
>
>At 03:27 PM 1/14/97 -0500, you wrote:
>>>Resent-Date: Tue, 14 Jan 1997 03:05:53 -0800
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>>>Date: Tue, 14 Jan 1997 10:52:18 +0200 (IST)
>>>From: Yakov Steinberg <[log in to unmask]>
>>>To: [log in to unmask]
>>>Subject: lifed pads
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>>>Fellow Technetters:
>>>
>>>What is the "rule" regarding lifted pads on multilayer boards? We have
>>>always scrapped them. A subcontractor recently returned a few of our
>>>boards which had lifted pads. We follow IPC-A-610B class II. The subject
>>>is not mentioned.
>>>
>>>
>>>Comments are appreciated.
>>>
>>>Ellen Berkman
>>>Excalibur Systems
***ALL NEW EMPF PHONE NUMBERS***
Jack Crawford
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