Hi all,
     
     Wonder if you can help. We occasionally experience problems with 
     solderability of joint toes on QFP's where the lead frame has been 
     cropped after packaging, which leaves non solderable nickel iron lead 
     frame at the toe of the joint.
     
     My questions are :-
     
     1  Is there any post cropping process which will avoid this 
     condition??
     
     2  What practical problems has this caused in production??
     
     3  Which manufacturers if any are worse than others in this respect??
     
     
     Hope you can help.
     
     If I don't come on the net again before have a good Christmas and new 
     year.
     
     Kind regards.
     
     John Burke.