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1995

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Subject:
From:
Mike Buetow <[log in to unmask]>
Date:
Wed, 29 Nov 1995 16:02:46 -0600 (CST)
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (33 lines)
IPC has task groups developing the following specifications:

IPC-D-2225, Sectional Design Standard for Multichip Modules (MCM-Ls) and 
MCM-L Assemblies

IPC-6015 Performance Specification for Organic Multichip Module 
Structures (MCM-L)

Each task group will next meet in Tempe, AZ during the week of January 
15, 1996. Contact Lisa Williams, IPC, for more information about joining 
the task groups.

Mike Buetow
IPC Technical Staff
2215 Sanders Road
Northbrook, IL 60062-6135
T: 708-509-9700
F: 708-509-9798
[log in to unmask]


On 29 Nov 1995, APeder01 wrote:

> 
>           Is there any IPC documentation for design and/or
>           acceptability of MCM-Ls?  If not, is there some in process,
>           or do we use IPC-D-275 and IPC-RB-276 the best we can?
> 
> 
> 



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