Rich, I would suggest looking at the aging requirments for boards in 
J-STD-003 this was developed after extensive literature review and IPC 
round robin testing.  I would also suggest review of IPC-TR-464  
Accelerated Aging for Solderability Evaluations, and IPC-TR-462, 
Solderability Evaluation of Printed Boards with Protective Coatings Over 
Long Term Storage.

Regards
***************************************************
David W. Bergman, Technical Director
IPC
7380 N. Lincoln Avenue
Lincolnwood, IL  60646
708-677-2850 x340 Phone
708-677-9570 Fax
email  [log in to unmask]
***************************************************



On Tue, 25 Jul 1995 [log in to unmask] wrote:

>      Hello,
>      
>         I would like to do some accelerated aging tests for solderability 
>      of eutectic solder. The solder is  over nickel over copper on board 
>      material (FR-4). Does any one know any respectable tests in the 
>      literature that claim to approximate 6 months and 1 year of solder 
>      aging. If such a claim is not explicitly stated how are the results of 
>      such tests viewed. Does the I.P.C. recommend a particular test. How 
>      about the military? I have a programmable temperature and humidity 
>      chamber at my disposal , but would like information on all tests.
>      
>         Thanks
>         Rich
> ------------------------------------------------------------------
>      Richard Olsen                Telephone (602)-268-3461
>      Continental Circuits Corp.   Fax       (602)-268-0208
>      3502 East Roeser Road        Pager     (602)-310-6245
>      Phoenix Arizona              Internet  [log in to unmask]
>      85040-2905
>      USA                    I make circuit boards,what do you do?
> ------------------------------------------------------------------
> 
>