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| From [log in to unmask] Sat Apr 27 14: |
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Rich, I would suggest looking at the aging requirments for boards in
J-STD-003 this was developed after extensive literature review and IPC
round robin testing. I would also suggest review of IPC-TR-464
Accelerated Aging for Solderability Evaluations, and IPC-TR-462,
Solderability Evaluation of Printed Boards with Protective Coatings Over
Long Term Storage.
Regards
***************************************************
David W. Bergman, Technical Director
IPC
7380 N. Lincoln Avenue
Lincolnwood, IL 60646
708-677-2850 x340 Phone
708-677-9570 Fax
email [log in to unmask]
***************************************************
On Tue, 25 Jul 1995 [log in to unmask] wrote:
> Hello,
>
> I would like to do some accelerated aging tests for solderability
> of eutectic solder. The solder is over nickel over copper on board
> material (FR-4). Does any one know any respectable tests in the
> literature that claim to approximate 6 months and 1 year of solder
> aging. If such a claim is not explicitly stated how are the results of
> such tests viewed. Does the I.P.C. recommend a particular test. How
> about the military? I have a programmable temperature and humidity
> chamber at my disposal , but would like information on all tests.
>
> Thanks
> Rich
> ------------------------------------------------------------------
> Richard Olsen Telephone (602)-268-3461
> Continental Circuits Corp. Fax (602)-268-0208
> 3502 East Roeser Road Pager (602)-310-6245
> Phoenix Arizona Internet [log in to unmask]
> 85040-2905
> USA I make circuit boards,what do you do?
> ------------------------------------------------------------------
>
>
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