TECHNET Archives

1995

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Fri, 08 Dec 1995 09:34:25 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (32 lines)
  
    \0
   TO:         I1263600 IBMMAIL   ipc internet technical query
  
   FROM:       DSTEWART EX2       D.Stewart        - Product Development Manager.
  
   DATE:       8 December 1995
   SUBJECT:    PTF - screened EMI shielding
   REFERENCE:  assembly
  
    I have just read an article from Circuitree on the use of screen
    printed polymer thick film for EMI shielding. This technology has
    been known by us for some time, but up to now it has not been asked
    for. Before I start a project to characterise the process, I would
    like to know if people are using this process for their EMI
    shielding on SMD boards.
           As all the SM gurus and solder paste experts keep telling
    you assembly people that, ideally soldermask must be below the
    level of the pad, how do you cope with effectively 3 layers of
    soldermask and one layer of copper paste, over the top of your
    tracks (which always seem to end in a pad !!)?
  
           Circuit Wise, Photocircuits and AMP+Akzo are all mentioned
    in this article as using this technology, so let's hear from you,
    if not your customers, on what effect this has.
  
    Dougal Stewart
    Exacta Circuits
    Scotland



ATOM RSS1 RSS2