Recently, there have been many statements made in this forum relative 
to fine lines and small via's.  A statement was made that as long as 
the vendor doesn't scream too loud, the designer will continue to 
push current technology.  Another statement was made that new 
technology should be investigated to meet the demands of future fine 
line and small hole requirements.  I recently ran across a company 
that appears to have addessed this subject, with future technology on 
the near horizon.  They are looking for customers and/or partners, 
with present or future requirements, to provide assistance.  They 
claim a new process for the manufacture of ultra-fine line PWB's on a 
production basis.  Their statement is as follows:

"New methods of making electronic interconnects for printed wiring 
boards that can produce feature sizes (including vias) of one mil and 
smaller on inner and outer layers of FR-4 material.  Methodology and 
production procedures have been worked on over the last 8 years and 
are fully proven.  They are covered by patents and patent 
applications.  Methodology includes the following:

1.   New lithography methods
2.   New deposition methods
3.   New methods of layer interconnect production
4.   Computer compensation of the production process

Production yields should be 95%, plus.
Production costs will be less than 40% of present 4 mil inner and 5 
mil outer layers"

If you have a present or future use of this technology, you may 
respond to the following:

IDM (International Design Modeling)
70 Horizon Drive
Bedford, NH  03110
Tel:  (603) 472-7068
Fax:  (603) 472 7043
E-Mail:  [log in to unmask]