Recently, there have been many statements made in this forum relative to fine lines and small via's. A statement was made that as long as the vendor doesn't scream too loud, the designer will continue to push current technology. Another statement was made that new technology should be investigated to meet the demands of future fine line and small hole requirements. I recently ran across a company that appears to have addessed this subject, with future technology on the near horizon. They are looking for customers and/or partners, with present or future requirements, to provide assistance. They claim a new process for the manufacture of ultra-fine line PWB's on a production basis. Their statement is as follows: "New methods of making electronic interconnects for printed wiring boards that can produce feature sizes (including vias) of one mil and smaller on inner and outer layers of FR-4 material. Methodology and production procedures have been worked on over the last 8 years and are fully proven. They are covered by patents and patent applications. Methodology includes the following: 1. New lithography methods 2. New deposition methods 3. New methods of layer interconnect production 4. Computer compensation of the production process Production yields should be 95%, plus. Production costs will be less than 40% of present 4 mil inner and 5 mil outer layers" If you have a present or future use of this technology, you may respond to the following: IDM (International Design Modeling) 70 Horizon Drive Bedford, NH 03110 Tel: (603) 472-7068 Fax: (603) 472 7043 E-Mail: [log in to unmask]