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1995

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From:
[log in to unmask] ( oliver kierse )
Date:
Fri, 8 Dec 95 09:22:45 GMT
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Two other advantages are:

- The filled vias provide very efficient heat sinking, particularly in the area
  under the IC. I also saw a presentation recently by Amkor Anam, where they
  showed data that adding a 4 x 4 matrix of balls under the IC, tied to the 
  die attach pad, gave a significant reduction in thermal resistance. Combine
  this with your approach to lower the thermal resistance.

- Using vias as you suggest allows the repair of individual balls that may not
  have reflowed properly, by touching up with a soldering iron and solder wire
  from the bottom side.

	Let us know how you get on.

Olly



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