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Date: | Fri, 8 Dec 95 09:22:45 GMT |
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Two other advantages are:
- The filled vias provide very efficient heat sinking, particularly in the area
under the IC. I also saw a presentation recently by Amkor Anam, where they
showed data that adding a 4 x 4 matrix of balls under the IC, tied to the
die attach pad, gave a significant reduction in thermal resistance. Combine
this with your approach to lower the thermal resistance.
- Using vias as you suggest allows the repair of individual balls that may not
have reflowed properly, by touching up with a soldering iron and solder wire
from the bottom side.
Let us know how you get on.
Olly
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