This has been my pet peeve with these highly filled systems - there are no specific acceptance or long term performance requirements. We cannot just apply the FR4 acceptance or performance specs for evaluating such systems because of their markedly different construction and processes involved in fabrication. 

Bhanu Sood

> On Aug 3, 2020, at 7:21 AM, Nigel Burtt <[log in to unmask]> wrote:
> 
> Anyone have any PCB assembly process experiences positive and negative for the PTFE/Ceramic based laminates in the Rogers 3000 series (specifically RO3006 and RO3010) compared to "standard" FR4 types
> 
> eg with respect to handling and storage, behaviour in solder reflow/rework, router or laser depanelling, etc etc
> 
> I'd be obliged if you point me to any caveats/gotchas