TECHNET Archives

August 2020

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Rogers 3000 series laminates
From:
Nigel Burtt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Nigel Burtt <[log in to unmask]>
Date:
Mon, 3 Aug 2020 06:21:54 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (6 lines) 
Anyone have any PCB assembly process experiences positive and negative for the PTFE/Ceramic based laminates in the Rogers 3000 series (specifically RO3006 and RO3010) compared to "standard" FR4 types

eg with respect to handling and storage, behaviour in solder reflow/rework, router or laser depanelling, etc etc

I'd be obliged if you point me to any caveats/gotchas

ATOM RSS1 RSS2