Victor, please refer to  IPC/JEDEC J-STD-020E, Moisture/Reflow Sensitivity
Classification for Nonhermetic Surface Mount Devices

Thanks
Tom

On Fri, Jan 10, 2020 at 10:16 AM Yuan-chia Joyce Koo <[log in to unmask]>
wrote:

> bake is good.  standard for flex, especially, polyimide adhesive high
> rel, high temp version.  prevent delamination, solderability and get
> your reliability in a tight controlled curve (minimize random
> failure)... bake in nitrogen oven is better if you have one. money/
> time well spend.
> IMHO.
> jk
> On Jan 10, 2020, at 7:53 AM, Jerry Dengler wrote:
>
> > TechNetters,
> >
> >
> >
> > We reviewed documentation from a flexible PCB manufacturer and saw
> > that
> > they recommend baking of the flex boards prior to assembly even if
> > they
> > are brand new boards in a Moisture Barrier Bag.
> >
> >
> >
> > Why wouldn't these be handled like any other moisture sensitive
> > component?
> >
> >
> >
> > How many of you that work with flexible PCBs are baking them even if
> > they come out of a MBB with A HIC card that shows no real moisture?
> >
> >
> >
> > Thank You,
> >
> >
> >
> > Jerry Dengler
> >
> > Production Manager
> >
> > Pergamon Corporation
> >
> > 380 Crooked Lane, Unit# 3
> >
> > King of Prussia, PA  19406-2567
> >
> > U.S.A.
> >
> > (610) 239-0721 Phone
> >
> >
>