Avanced IC Packaging: Worldwide Technologies, Materials and Markets  
to 2022 - Covering Multichip Packaging, Technology Trends, Key  
Application Forecasts, and Company Profiles


Research and Markets Logo


News provided by

Research and Markets
Mar 08, 2019, 11:30 ET
Share this article


DUBLIN, March 8, 2019 /PRNewswire/ -- The "Advanced IC Packaging  
Technologies, Materials, and Markets 2018 Edition" report has been  
added to ResearchAndMarkets.com's offering.

The demand for consumer electronics and mobile communications devices  
that keep us connected is driving electronics manufacturers to  
deliver ever-more compact and portable products. Today's users ask  
for solutions that deliver more functionality, added performance,  
higher speed, and smaller form factors. Software systems and billions  
of networked devices are rapidly coalescing into a vast Internet of  
Things.

All of these forces are driving semiconductor companies to develop  
new advanced IC packaging technologies to provide greater silicon  
integration in increasingly miniaturized packages. The last decade  
has seen an explosion of new products including fan-out wafer-level  
packaging (FOWLPs), stacked IC packages and complex system-in- 
packages (SiPs), as well as advances in package substrates, flip chip  
interconnection and through-silicon vias. All these advances are  
enabling significant improvements in packaging density and opening  
new market opportunities for manufacturers.

Advanced IC Packaging Technologies, Materials and Markets, 2018  
Edition reveals the latest technology and market trends in the IC  
packaging industry by focusing on the most advanced packaging  
products and solutions-those critical to success in developing  
cutting-edge products and in maintaining technological leadership.  
Every market or application segment discussed in the report includes  
quantitative analysis based on the most current historical years,  
2016 and 2017, as well as forecasts from 2018 through 2022. Each of  
the six chapters examines the market from a different perspective.

Chapter 3: Overview of Worldwide IC Packaging Markets, outlines the  
major IC packaging market segments in terms of I/O count, device  
function and the key application markets for IC devices, including  
cellular phones, tablets, PC, DVD players, digital cameras, etc. This  
chapter also includes an overview of the major economic and industry  
trends driving the semiconductor sector, including mergers and  
acquisitions, and the impact from emerging markets such as the  
Internet of Things, artificial intelligence and machine learning.  
Market forecasts include units, prices, packaging revenue, package  
types and device types.

Chapter 4: Advanced IC Packaging Markets provides an in-depth  
discussion of the technologies and market trends of the semiconductor  
industry's advanced packaging solutions:

Fan-out wafer-level packaging (FOWLP)
Multi-row QFN packaging (Fan-out wafer-level packaging (FOWLP)
Multi-row QFN packaging (MRQFN)
Vertically stacked multichip packages: TSOPs, QFNs, FBGAs, and WLPs
System-in-packages (SiPs): package-on-packages,package-in-packages,  
multichip modules and stacked WLPs used as components in SiPs
This chapter analyzes the total market and individual market segments  
from a number of viewpoints, including their characteristics,  
functions, applications, technology, and the key challenges facing  
the various advanced packaging solutions. Numerous tables and figures  
provide detailed market data and forecasts for unit shipments,  
revenues, prices, I/O-count, and die usage. The chapter ends with an  
examination of the substrate materials and embedded components used  
in SiP assembly. Forecasts include package units, area of shipped  
materials, and substrate revenues.

Chapter 5: Interconnection Technologies and Solutions, provides a  
comprehensive examination of wire bonding and flip chip technology  
and market trends, and includes in-depth analysis of flip chip  
markets in terms of specific devices and packaging types. The chapter  
also examines the market potential of through-silicon vias (TSVs) for  
2.5D and 3D packaging. The chapter tables and figures present unit  
shipments and revenue forecasts for each market segment.

Chapter 6: Advanced IC Packaging Company Profiles presents profiles  
of twenty advanced packaging companies from across the IC packaging  
spectrum, including large and small competitors from among OSATs,  
foundries and IDMs. Each profile gives a short company background and  
presents examples of its advanced packaging products.

Advanced IC Packaging Technologies, Materials and Markets, 2018  
Edition is an effective tool for companies determined to stay  
informed about the latest advances in IC packaging, and in assessing  
the future of this important industry.

Report Coverage

Fan-out WLPs
Multi-row QFNs
Interconnection Technologies
Through-Silicon Vias (TSV)
2.5D and 3D Integration
Stacked Packages
System-in-Package
Report Highlights

Industry Outlook
Market Analysis and Forecasts, 2016-2022
Multichip Packaging
Technology Trends
Key Application Forecasts
Company Profiles
Topics Covered

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Overview of Worldwide IC Packaging Markets
3.1 Chapter Overview
3.2 Recent Global Market Trends
3.3 IC Packaging Market

Covers: Worldwide IC Packaging Market Segments
3.4 Packaging Market Unit and Revenue Forecasts

Includes: Packaging by I/O count and devices
3.5 Key Application Markets for IC Devices

Includes: Cellular handsets, Tablets, Personal Computers, Servers,  
Workstations, Set Top Boxes, DVD Players, MP3/MP4 Players, Digital  
Cameras, Camcorders, GPS
3.6 Industry Trends Driving the Semiconductor Sector

Chapter 4: Advanced Packaging Markets
4.1 Chapter Overview

Covers: Advanced Packaging Markets Segments, Application Trends,  
Forecasts of Markets
4.2 Fan-Out Wafer Level Packages

Covers: WLP Market Overview, Competition and Cooperation, Technology  
Challenges, Panel Level-Packaging, WLP Trends and Forecasts
4.3 Multi-Row QFN Packages

Covers: Market Overview, Trends and Forecasts
4.4 Overview of Multichip Packaging Technology

Covers: Types of Multichip Packages, Benefits and Shortcomings,  
Packaging Challenges and Solutions, Wafer Thinning and MCP Market  
Trends/Forecasts
4.5 Stacked Multichip Packaging Market Segments

Covers: Market Trends and Forecasts for Stacked TSOPs, Stacked QFNs,  
Stacked FBGAs, Stacked WLPs
4.6 System-in-Packaging Market Overview

Covers: Types of SiPs, Key Features of SiPs, SiP vs. System on Chip,  
Challenges for SiP, Market Trends and Forecasts for total Market  
Segment, Package-on-Packages, Package-in-Packages, Multichip Modules,  
Stacked WLPS in SiPs
4.7 Substrates

Covers: Market Overview, Substrate Market Trends and Forecasts  
(materials usage and embedded components)
Chapter 5: Interconnection Technologies and Solutions
5.1 Interconnection Techniques Overview
5.2 Wire Bonding
5.2.1 Wire Bonding Methods
5.2.2 Wire Materials
5.2.3 Wire Bonding Market Trends and Forecasts
5.3 Flip Chip
5.3.1 the Flip Chip Process
5.3.2 Flip Chip Packaging Market Trends and Forecasts
5.3.3 Flip Chip Package Device Market Trends and Forecasts
5.3.4 Bare Die Flip Chip Market Trends and Forecasts
5.4 Through-Silicon Vias
5.4.1 Searching for Higher Silicon Integration Solution 5.4.2 Status  
of TSV Interconnection
5.4.3 Interposers and 2.5D: Not just an Interim Step
5.4.4 Forecasts for TSV by Market Segment

Chapter 6: Advanced IC Packaging Company Profiles
6.1 Chapter Overview
6.2 3D Plus, Inc.
6.3 Advanced Semiconductor Engineering, Inc.
6.4 Amkor Technology, Inc.
6.5 Carsem, Inc.
6.6 ChipMOS Technologies (Bermuda), Ltd.
6.7 CONNECTEC Japan Corporation
6.8 Deca Technologies
6.9 FlipChip International, LLC
6.10 HANA Micron Co., Ltd.
6.11 Interconnect Systems Inc. (ISI)
6.12 Jiangsu Changjiang Electronics Technology
6.13 Palomar Technologies
6.14 Powertech Technology, Inc.
6.15 Shinko Electric Industries Co, Ltd
6.16 Signetics Corporation
6.17 Siliconware Precision Industries Co.
6.18 SPEL Semiconductor, Ltd.
6.19 Taiwan Semiconductor Manufacturing Co. Ltd.
6.20 United Test and Assembly Center, Ltd.
6.21 Xintec, Inc.

Glossary of Terms

For more information about this report visit https:// 
www.researchandmarkets.com/research/tdrkr6/advanced_ic?w=5

Research and Markets also offers Custom Research services providing  
focused, comprehensive and tailored research.

Media Contact:

Research and Markets
Laura Wood, Senior Manager
[log in to unmask]

For E.S.T Office Hours Call +1-917-300-0470
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716

SOURCE Research and Markets

Related Links

http://www.researchandmarkets.com

×
On Sep 5, 2019, at 4:19 PM, Bev Christian wrote:

> TechNetters,
> I am on the scrounge again.  In one of my lectures to the students  
> I want to talk about the evolution of lead count and component type  
> change. Right now I have a graph of unknown origin that for 1999  
> shows % as a function of lead count for PTH, SMT, bare die and  
> array packages (the latter broken out from I presume SMT, unless  
> they are including PGAs as well).  I have unsuccessfully tried to  
> find a more recent version, say for at least 2016, if not 2017 or  
> 2018. Can anyone provide me such a graph or point me in the  
> direction of where I can find such?
> Regards,
> Bev