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| Reply To: | (Designers Council Forum) |
| Date: | Tue, 24 Jan 2017 16:25:51 +0000 |
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Thanks, Pete. Will do!
Bill Gebhardt, C.I.D. +
PCB Designer
Mission Systems
General Atomics Aeronautical Systems, Inc.
Bldg A03-1381D
16761 Via Del Campo Ct
San Diego, CA 92127
Office: (858) 762-5035
Cell: (909) 229-7824
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-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Peter G. Houwen
Sent: Tuesday, January 24, 2017 6:40 AM
To: [log in to unmask]
Subject: Re: [DC] -EXT-Re: [DC] Via In Pad technology
One more thing - once you've put you boards into the fill & Cap processes, i doesn't add cost to fill more holes. (within reason)
And see the earlier discussion on this list about putting vias in thermal pads. Plenty of risk there that you need to address
Pete
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