We are making space quality MLBs. We are using hot mounting for micro section.
My understanding is hot mounting(Phenolic power of Buehler at 150 Deg C ,180 bar & 5 minutes) of PCB specimen will destroy the PCB specimen Our metallographers are against using cold mounting. The reason is they claim poor edge retention & high shrinkage and observing faults are difficult.
Which method of mounting is best for micro sectioning PCB ?. Which is the best resin & hardener having low shrinkage and high edge retention ?.
regards,
R.Saravanan