We are making space quality MLBs. We are using hot mounting for micro section. My understanding is hot mounting(Phenolic power of Buehler at 150 Deg C ,180 bar & 5 minutes) of PCB specimen will destroy the PCB specimen Our metallographers are against using cold mounting. The reason is they claim poor edge retention & high shrinkage and observing faults are difficult. Which method of mounting is best for micro sectioning PCB ?. Which is the best resin & hardener having low shrinkage and high edge retention ?. regards, R.Saravanan