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January 2013

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TechNet <[log in to unmask]>
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Date:
Fri, 4 Jan 2013 10:23:28 -0600
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TechNet E-Mail Forum <[log in to unmask]>, Ramakrishnan Saravanan <[log in to unmask]>
Subject:
Hot mounting micro section of PCB
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Ramakrishnan Saravanan <[log in to unmask]>
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We are making space quality MLBs. We are using hot mounting for micro section. 
My understanding is hot mounting(Phenolic power of Buehler at 150 Deg C ,180 bar &  5 minutes)  of PCB specimen will destroy the PCB specimen Our metallographers are against using cold mounting. The reason  is they claim poor edge retention & high shrinkage   and observing faults are difficult. 

Which method of mounting is best for micro sectioning PCB ?. Which is the best resin & hardener having low shrinkage and high edge retention ?.

regards,

R.Saravanan

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