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November 2010

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Subject:
From:
Mumtaz Bora <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mumtaz Bora <[log in to unmask]>
Date:
Sat, 13 Nov 2010 08:36:40 -0800
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Thank-you Werner. I will check your column. 


Mumtaz Bora

Senior Packaging Engineer

Peregrine Semiconductor

9380 Carroll Park Drive

San Diego, CA 92121

858-795-0112-direct

858-731-9499 -fax

[log in to unmask]

 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Friday, November 12, 2010 8:35 PM
To: [log in to unmask]
Subject: Re: [TN] Wire Bond Pull failures

 Hi Mumtaz,
Each bond results in slightly different deformation geometry of the wire
which results in different degrees of stress concentration-thus,
differences in the pull strength of these geometries.
What you really need to worry about is where the loading in product is
coming from, what is the magnitude of the loading and whether it is
steady-state or cyclic loading.

 You may want to look in the upcoming December issue of Global SMT &
Packaging magazine, where I deal with wire bond fatigue in my
reliability column.


 
Werner
Upcoming workshops:
November 2 & 9, SMTA Webtorial,
     "Fundamentals in Solder Joint Reliability"
December 7 & 14, SMTA Webtorial,
     "Acceleration Models, Accelerated Reliability Tests and
ScreeningProcedures"

 

-----Original Message-----
From: Mumtaz Bora <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Nov 12, 2010 9:15 pm
Subject: [TN] Wire Bond Pull failures


Hello TechNetters,

 

I have some wirebonds on a Hi -Rel package that pulled below 2.0 gm

minimum  per Mil -Std -883. I have taken some SEM images of failed and

good bonds. Customer has a concern with plane of fracture of the failed

bonds even though it is break at "neck" . . It is Aluminum wire/to

Aluminum bond pad wedge bonded ultrasonically and aluminum wire to gold

plated post also bonded ultrasonic. Wire pull is post seal. I have

uploaded the file of images on the TechNet groupsite .I will appreciate

some feedback from wirebonding experts on the forum.

 

 http://ipc-technet.groupsite.com/main/summary

<http://ipc-technet.groupsite.com/main/summary> 



Thank-you, Mumtaz



Mumtaz Bora



Senior Packaging Engineer



Peregrine Semiconductor



9380 Carroll Park Drive



San Diego, CA 92121



858-795-0112-direct



858-731-9499 -fax



[log in to unmask]



 



 



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