Hello TechNetters,
I have some wirebonds on a Hi -Rel package that pulled below 2.0 gm
minimum per Mil -Std -883. I have taken some SEM images of failed and
good bonds. Customer has a concern with plane of fracture of the failed
bonds even though it is break at "neck" . . It is Aluminum wire/to
Aluminum bond pad wedge bonded ultrasonically and aluminum wire to gold
plated post also bonded ultrasonic. Wire pull is post seal. I have
uploaded the file of images on the TechNet groupsite .I will appreciate
some feedback from wirebonding experts on the forum.
http://ipc-technet.groupsite.com/main/summary
<http://ipc-technet.groupsite.com/main/summary>
Thank-you, Mumtaz
Mumtaz Bora
Senior Packaging Engineer
Peregrine Semiconductor
9380 Carroll Park Drive
San Diego, CA 92121
858-795-0112-direct
858-731-9499 -fax
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