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November 2010

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Subject:
From:
Bob Landman <[log in to unmask]>
Reply To:
Bob Landman <[log in to unmask]>
Date:
Sat, 13 Nov 2010 10:44:40 -0500
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Mumtaz,

Formerly our company was in Burlingame CA.  One of our nextdoor neighbors was Uthe Technology http://www.uthe.com/about.htm 

We became good friends them.  The founder and president (a real hands on guy) was Mike Uthe (he was one of Silicon Valley's pioneers who started in a garage (we started in a friend's office the size of a closet :-).  FYI, Mike also develpped the First commercial quadrupole mass spectrometer at Electtronics Associates, Inc (EAI) to NASA as residual gas analyzer for space chamber research. Helped develop the ramjet nuclear powered engine at Lawrence Livermore National Labs and EAI's analog computers (us really old guys know what they are).  

Mike's VP Volkhard Quandt has been with the company for many decades.  If there's anyone who knows everything about wire bonding (next to Mike who, sad to say, passed away many years ago) its Volkhardt.  I witnessed Mike, Volkhardt and their partner Loren Wright develop many of the ultrasonic bonder anvils that K&S and all the other companies use.

Contact him at phone (609) 406-7019 - general e-mail is  [log in to unmask]  Say hello from me (its been many years since we chatted) and see if he can help you.  (offer good for all TechNetters :-)

Bob Landman
H&L Instruments, LLC
www.hlinstruments.com
LDFCoatings, LLC
www.ldfcoatings.com

P.S. For a great timeline of vacuum science and technology, this is a gem http://www.avs.org/pdf/timelineD.pdf

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mumtaz Bora
Sent: Friday, November 12, 2010 9:15 PM
To: [log in to unmask]
Subject: [TN] Wire Bond Pull failures

Hello TechNetters,
 
I have some wirebonds on a Hi -Rel package that pulled below 2.0 gm minimum  per Mil -Std -883. I have taken some SEM images of failed and good bonds. Customer has a concern with plane of fracture of the failed bonds even though it is break at "neck" . . It is Aluminum wire/to Aluminum bond pad wedge bonded ultrasonically and aluminum wire to gold plated post also bonded ultrasonic. Wire pull is post seal. I have uploaded the file of images on the TechNet groupsite .I will appreciate some feedback from wirebonding experts on the forum.
 
 http://ipc-technet.groupsite.com/main/summary
<http://ipc-technet.groupsite.com/main/summary> 

Thank-you, Mumtaz

Mumtaz Bora

Senior Packaging Engineer

Peregrine Semiconductor

9380 Carroll Park Drive

San Diego, CA 92121

858-795-0112-direct

858-731-9499 -fax

[log in to unmask]

 

 

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