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Date: | Thu, 11 Nov 2010 15:38:34 -0600 |
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Hi Prashant - the items of concern for the reballing operations would be:
1) temperature control of the deballing and reballing procedures; 2)
moisture levels/control of the BGA component; 3) cleanliness control of
the procedure in terms of ionic residues from the solder processes; 4) ESD
control; 5) physical damage control in terms of pad damage and soldermask
damage.
Dave Hillman
Rockwell Collins
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prashant chopra <[log in to unmask]>
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[TN] BGA reballing -- ROHS to Lead solder balls
Hi,
We are having a ROHS BGA which we want to use in the Non-ROHS (leaded)
process. We are looking at option of having the BGA reballed. We would
have the ROHS solder balls removed and replaced with the Non-ROHS solder
balls.
I need help to know what can be the technical risks in using these BGA?
Also, what can be the risk and issues associated with this reballing
process?
Also, what are the critical precautions, checks and tests which should be
done after the reballing of the BGA before we use them on the PWB?
Thanks to all for the support and advice.
Rgds
prashant
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