Hi Prashant - the items of concern for the reballing operations would be: 1) temperature control of the deballing and reballing procedures; 2) moisture levels/control of the BGA component; 3) cleanliness control of the procedure in terms of ionic residues from the solder processes; 4) ESD control; 5) physical damage control in terms of pad damage and soldermask damage. Dave Hillman Rockwell Collins [log in to unmask] prashant chopra <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 11/11/2010 04:52 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to prashant chopra <[log in to unmask]> To [log in to unmask] cc Subject [TN] BGA reballing -- ROHS to Lead solder balls Hi, We are having a ROHS BGA which we want to use in the Non-ROHS (leaded) process. We are looking at option of having the BGA reballed. We would have the ROHS solder balls removed and replaced with the Non-ROHS solder balls. I need help to know what can be the technical risks in using these BGA? Also, what can be the risk and issues associated with this reballing process? Also, what are the critical precautions, checks and tests which should be done after the reballing of the BGA before we use them on the PWB? Thanks to all for the support and advice. Rgds prashant ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------