Bob,

why so thin Tin?  And no barrier? What's the purpose? And what do you mean 
with a 'carrier' ?
When testing conductor adhesion, we simple make a board sample with a number 
of copper traces, then cut it so we get a large number of square pieces 
approx. 1x1 inch. Next, we apply a solder paste dot on the center of each 
square, size about 2 mm. This is followed by soldering kind of needles with 
a round plate to each square sample. Vapour phase or oven soldered. Finally, 
the samples are placed in a Sebastian pulling machine's chuck and depress 
'pull'. The machine increases the pull force until the plate headed needle 
separates from the FR4 matrix and the value is presented on the display. 
Years ago, we did this test frequently on board coupons, but there is little 
interest in doing it today, because adhesion problems are very rare.

Inge


----- Original Message ----- 
From: "bob wettermann" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, April 09, 2009 5:17 PM
Subject: [TN] Friday Theorizing


> Dear Technetters:
>
> Has anyone done any adhesion testing of a 2um tin-electrocoated surface 
> (copper carrier) to FR-4? How about a 0.100um tin electrocoated surface? 
> Can someone theorize on which might give better adhesion using a 2-part 
> epoxy?
>
> Regards
>
> Bob Wettermann
> BEST
> PH 847-767-5745
>
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