This is reply from our Fabricator from china even from the COB fabricator
that it is difficult and they got feedback from different client so
suggested not to use Alumin. for ENIG. so i am moving to wards Flash gold.
but nobody is commenting on the thicknesses for Flash gold.
Please do comments on what should be thickness of gold and nickel in Flash
gold plating ?


Thanks
Regards,
Anand


On Thu, Oct 2, 2008 at 1:00 AM, Hernefjord Ingemar <
[log in to unmask]> wrote:

> Anand,
> who said aluminum is not viable for ENIG? We have produced some million
> boards with Al wedge bonding on ENIG. In fact, you bond on the underlying
> nickel. If the gold is thin, which is the case with ENIG, no hazardous IMCs
> will grow.
> Inge
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Anand
> Sent: den 1 oktober 2008 23:03
> To: [log in to unmask]
> Subject: [TN] Electrolytic (Flash) Nickel Gold Finish
>
> Hi All,
>
> I want to use Alluminum WEDGE wire bonding for COB.
> as the ENIG is suitable only for Gold Wire Bonding .....! which i don't
> want.
>
> I thought about Electrolytic (Flash) Nickel Gold Finish. as alluminum wire
> bond can be used.
>
> but i don;t know the recommended thickness of nickel and Gold for
>
> A) Electrolytic ?????? I didn't found any ipc std for this ?
>
> B) Can any ONE please guide me for the thickness of this plating....!
>
> C) again as there is no phosphurus used in electrlytic process how can we
>    prevent the corrosion for this plating ?
>
>  thanks and eagerly waiting for the answer on above three questions .....
>
>
>
> Regards,
> Anand
>
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-- 
With Best Regards,
Anand Paliwal

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