Anand,
In your original message you say that ENIG is good for gold wire but not  
good for Al wire. This is backwards. 
ENIG is good for Al wire and is not good for gold wire.
For gold wire to be successful you need a minimum of 20 uins of soft gold  
for bonding.  ENIG only has 2-4 uins of gold.
As was stated earlier the Al wire bonds to the underlying Ni and  does 
require the thicker gold mentioned above.
 
ENIG is suitable for Al wire bonding, however if you want to use  
electrolytic Ni/Au  you should ~200 uins of Ni with only 2-8 uins of flash  gold ( the 
word flash implies very thin).
 
 
Regards
George Milad
George Milad
Chairman of IPC  Plating Committee
National Accounts Manager for Technology
Uyemura International  Corp (UIC)
249 Town Line Rd 
Southington CT  06489
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Cell: (516) 901  3874



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