Hi Graham - I would look at to possible root causes: A) oxidation of the 
paste due to poor print or a flux issue in the paste; 2) Improper reflow 
temp/profile. Is the 1 of 10 leads the corner lead? Many times the corner 
leads are the grounding leads which are significantly bigger heat thieves 
than the other component leads. Basically the lead gets hot enough to 
almost melt the solderpaste. An adjustment of reflow temp/profile would 
cure this.

Good Luck

Dave Hillman
Rockwell Collins
[log in to unmask]




Graham Naisbitt <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
08/15/2007 05:24 AM
Please respond to
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Subject
Re: [TN] Lead-Free Problems? and Tin Lead too!






Techies

Apropos the earlier exchange, take a look at this link: http:// 
news.bbc.co.uk/1/hi/technology/6946042.stm

Maybe all will be well with the XBox in 2011?

How about this curious problem: I have a client suffering from an 
apparent refusal of the tin and lead to meld together in his process 
but on on 1 to 10 individual joints per assembly. It looks like a 
cold joint (stay off this Dewey!) yet the joint is hard but separated 
metals - anyone got any clues? Pretty much every conceivable test has 
been run without a solution.

What could prevent tin and lead melding - Mr Hillman or Mr Pauls?

Kindest regards
Graham Naisbitt

[log in to unmask]

www.gen3systems.com

Phone: +44 (0)12 5252 1500
Mobile: +44 (0) 79 6858 2121


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On 13 Aug 2007, at 18:50, Bloomquist, Ken wrote:

> I thought this was worth sharing. The Chicago Tribune has an article;
> "Coolest electronic gear way to hot for its own good". In the article
> they write:
>
> "The Xbox's failure problem has generated more than 1,100 
> complaints to
> ConsumerAffairs.com, an online publisher of consumer news and recall
> information.
>
> Adam Carpentieri, who said his online repair site, Xbox360- 
> pros.com, had
> fixed more than 2,000 systems, surmised that the culprit was the
> lead-free solder Microsoft used to comply with European Union 
> standards
> for reducing hazardous materials in printed circuit boards.
>
> As the solder repeatedly heats and cools, it cracks away from the
> circuit board's tiny copper connections, causing them, in turn, to
> separate and fracture."
>
> Could that possibly be?
>
> KennyB
>
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