Hi Graham - I would look at to possible root causes: A) oxidation of the paste due to poor print or a flux issue in the paste; 2) Improper reflow temp/profile. Is the 1 of 10 leads the corner lead? Many times the corner leads are the grounding leads which are significantly bigger heat thieves than the other component leads. Basically the lead gets hot enough to almost melt the solderpaste. An adjustment of reflow temp/profile would cure this. Good Luck Dave Hillman Rockwell Collins [log in to unmask] Graham Naisbitt <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 08/15/2007 05:24 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Graham Naisbitt <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] Lead-Free Problems? and Tin Lead too! Techies Apropos the earlier exchange, take a look at this link: http:// news.bbc.co.uk/1/hi/technology/6946042.stm Maybe all will be well with the XBox in 2011? How about this curious problem: I have a client suffering from an apparent refusal of the tin and lead to meld together in his process but on on 1 to 10 individual joints per assembly. It looks like a cold joint (stay off this Dewey!) yet the joint is hard but separated metals - anyone got any clues? Pretty much every conceivable test has been run without a solution. What could prevent tin and lead melding - Mr Hillman or Mr Pauls? Kindest regards Graham Naisbitt [log in to unmask] www.gen3systems.com Phone: +44 (0)12 5252 1500 Mobile: +44 (0) 79 6858 2121 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- Gen3 Systems Limited Unit B2, Armstrong Mall Southwood Business Park Farnborough Hampshire GU14 0NR - UK ENGINEERING RELIABILITY IN ELECTRONICS Registered Number: 4639449 (England & Wales). 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On 13 Aug 2007, at 18:50, Bloomquist, Ken wrote: > I thought this was worth sharing. The Chicago Tribune has an article; > "Coolest electronic gear way to hot for its own good". In the article > they write: > > "The Xbox's failure problem has generated more than 1,100 > complaints to > ConsumerAffairs.com, an online publisher of consumer news and recall > information. > > Adam Carpentieri, who said his online repair site, Xbox360- > pros.com, had > fixed more than 2,000 systems, surmised that the culprit was the > lead-free solder Microsoft used to comply with European Union > standards > for reducing hazardous materials in printed circuit boards. > > As the solder repeatedly heats and cools, it cracks away from the > circuit board's tiny copper connections, causing them, in turn, to > separate and fracture." > > Could that possibly be? > > KennyB > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail > to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/ > archives > Please visit IPC web site http://www.ipc.org/contentpage.asp? > Pageid=4.3.16 for additional information, or contact Keach Sasamori > at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------