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November 2006

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Subject:
Re: BGA anomaly
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Mon, 20 Nov 2006 14:27:25 -0500
Content-Type:
text/plain
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text/plain (116 lines) 
Crack at what interface?

Richard,


Ramon,



Crack at what interface?



Richard,



If "lead-rich zones within the finished solder joint that are

undesirable" what makes them undesirable in a SnPb solder joint?



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon

Sent: Monday, November 20, 2006 1:50 PM

To: [log in to unmask]

Subject: Re: [TN] BGA anomaly



    The question is: are there 63/37 SnPb paste with flux that can

endure LF profiles? Or will the flux burn out and leave dull solder

joints?  SAC305 balls and 63/37 do not make reliable SJs. There is a

tendency to crack at the interface.

     Ramon 

 



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.

Sent: Monday, November 20, 2006 12:37 PM

To: [log in to unmask]

Subject: Re: [TN] BGA anomaly



Werner is correct, and my two cents worth; the profile must be of such

duration to ensure that the lead in the solder joint is properly

homogenized within the solder joint. Else you will have lead-rich zones

within the finished solder joint that are undesirable. 



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier

Sent: Monday, November 20, 2006 9:06 AM

To: [log in to unmask]

Subject: Re: [TN] BGA anomaly



Hi Iain,

For a mixture of SnPb & PbF part (in particular PbF BGA's - SAC305)

using a

63/37 SnPb solder, the preferred reflow profile is definitely a LF-SAC

profile, NOT a SnPb-profile.



Werner



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