Crack at what interface? Richard, Ramon, Crack at what interface? Richard, If "lead-rich zones within the finished solder joint that are undesirable" what makes them undesirable in a SnPb solder joint? -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon Sent: Monday, November 20, 2006 1:50 PM To: [log in to unmask] Subject: Re: [TN] BGA anomaly The question is: are there 63/37 SnPb paste with flux that can endure LF profiles? Or will the flux burn out and leave dull solder joints? SAC305 balls and 63/37 do not make reliable SJs. There is a tendency to crack at the interface. Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. Sent: Monday, November 20, 2006 12:37 PM To: [log in to unmask] Subject: Re: [TN] BGA anomaly Werner is correct, and my two cents worth; the profile must be of such duration to ensure that the lead in the solder joint is properly homogenized within the solder joint. Else you will have lead-rich zones within the finished solder joint that are undesirable. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier Sent: Monday, November 20, 2006 9:06 AM To: [log in to unmask] Subject: Re: [TN] BGA anomaly Hi Iain, For a mixture of SnPb & PbF part (in particular PbF BGA's - SAC305) using a 63/37 SnPb solder, the preferred reflow profile is definitely a LF-SAC profile, NOT a SnPb-profile. 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