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November 2006

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From:
"Braddock, Iain" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Braddock, Iain
Date:
Mon, 20 Nov 2006 15:51:37 -0000
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Werner ,
 
I understand the issues around not achieving a homogenous joint ie. >217C that is why I ran a profile peak of 232ish, which I would have thought would have been enough to provide a good joint but not high enough to cause problems with packages that are not rated for PbF.
 
Regards,
    Iain.

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: 20 November 2006 15:06
To: Braddock, Iain; [log in to unmask]
Subject: Re: [TN] BGA anomaly


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Hi Iain,
For a mixture of SnPb & PbF part (in particular PbF BGA's - SAC305) using a 63/37 SnPb solder, the preferred reflow profile is definitely a LF-SAC profile, NOT a SnPb-profile.

Werner




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