Dear all wire bond experts

Is 0.8 micron RMS roughness value achievable on wire bond pad area?  as per
IPC 6012B - 3.5.4.3. Do users regularly sample lots under 1000X or an SEM?
How do you judge it ?

What is normally acceptable at low end bonding of 10 to 50 wbps?

thanks
Anil


micro interconnexion pvt. ltd

D3-12A, Corlim Industrial Estate

Corlim, Ilhas , Goa , India 403110

tel: 91-832-2284209/337. fax 2284209/2285271

e mail: HYPERLINK "mailto:[log in to unmask]"[log in to unmask]

Leaders in Gold plated PCBs - selective/ cob

an ISO 9001-2000 Company




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