Dear all wire bond experts Is 0.8 micron RMS roughness value achievable on wire bond pad area? as per IPC 6012B - 3.5.4.3. Do users regularly sample lots under 1000X or an SEM? How do you judge it ? What is normally acceptable at low end bonding of 10 to 50 wbps? thanks Anil micro interconnexion pvt. ltd D3-12A, Corlim Industrial Estate Corlim, Ilhas , Goa , India 403110 tel: 91-832-2284209/337. fax 2284209/2285271 e mail: HYPERLINK "mailto:[log in to unmask]"[log in to unmask] Leaders in Gold plated PCBs - selective/ cob an ISO 9001-2000 Company -- No virus found in this outgoing message. Checked by AVG Free Edition. Version: 7.1.405 / Virus Database: 268.12.5/451 - Release Date: 9/19/2006 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------