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Date: | Wed, 20 Sep 2006 07:52:28 -0400 |
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32 RMS is fairly easy to obtain. We have some contracts that require 16
RMS and we are also able to comply to these with some special handling.
Flying probe testing become a requirement to keep probe marks from the
pristine area.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 21
Fax - 802.257.0011
<http://www.vtcircuits.com/>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Anil Kher
Sent: Wednesday, September 20, 2006 1:54 AM
To: [log in to unmask]
Subject: [TN] Bond pad surface roughness 0.8 microns
Dear all wire bond experts
Is 0.8 micron RMS roughness value achievable on wire bond pad area? as
per
IPC 6012B - 3.5.4.3. Do users regularly sample lots under 1000X or an
SEM?
How do you judge it ?
What is normally acceptable at low end bonding of 10 to 50 wbps?
thanks
Anil
micro interconnexion pvt. ltd
D3-12A, Corlim Industrial Estate
Corlim, Ilhas , Goa , India 403110
tel: 91-832-2284209/337. fax 2284209/2285271
e mail: HYPERLINK "mailto:[log in to unmask]"[log in to unmask]
Leaders in Gold plated PCBs - selective/ cob
an ISO 9001-2000 Company
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