There is a new IPC-4761 - Design Guide for Protection of Printed Board
Via Structures.

Veronika Anderson, C.I.D.
Senior Electrical / Mechanical Designer
 
PerkinElmer Optoelectronics
1330 East Cypress St.,
Covina, CA 91724
Phone: (626) 967-9521 X 236
E-mail: [log in to unmask]
 
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-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Adam
Smith
Sent: Thursday, September 28, 2006 7:53 AM
To: [log in to unmask]
Subject: [DC] Wave soldering and vias.

Does anyone know if there is an IPC standard referring to the tenting of
vias and/or vias and wave soldering? We are having a problem where
solder is bridging between thru-hole pins and some exposed vias. My
solution is to tent the vias with soldermask to reduce the possibility
of shorts between the pins and vias. Is there a standard that backs me
up or refers to this?

Thanks,

Adam Smith, CID
IR Halifax
7020 Mumford Rd
Halifax NS B3L 4S9
902.431.1644 x262
 

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