There may well be differences in how terminology is used throughout the industry. I am used to refering to bed-of nails as the method of access (spring-loaded test pins in a matrix) while ICT refers to a test method and a greater toolset. ICT is always fixtured with a bed-of nails, while functional test may gain access to the nets through a bed of nails (from the same fixture vendors as ICT fixtures) or be connectorized, so it is mostly in the context of a functional test the method of access needs to be specified.
________________________________________________
Haldor Husby, Senior Development Engineer
Data Respons Norge AS
Kongsberg Næringspark
P.O. Box 1022
N-3601 Kongsberg, Norway
Tel: +47 32 29 94 00 Fax: +47 32 29 94 40
Dir: +47 32 29 94 18 Mob: +47 48 04 83 68
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-----Original Message-----
From: Jack Olson [mailto:[log in to unmask]]
Sent: Tue 7/25/2006 11:43 PM
To: (Designers Council Forum); Haldor Husby
Subject: Re: [DC] ICT testing
Maybe it is just a case of terminology,
but ICT *is* a bed of nails fixture,
where functional test uses the connectors or POGO
(or am I having a senior moment?)
Jack
On 7/25/06, Haldor Husby <[log in to unmask]> wrote:
>
> Hi Nagaraj -
> I don't know what you mean by Bed of Nails testing. People mostly talk
> about bed-of nails in connection to a functional test where the nets are
> accessed through a matrix of pogo-pins. ICT (in-circuit Test) is in
> general not a functional test, but is in the simplest form a test where
> the impedances of all accessible nets are measured to help detect
> manufacturing defects like shorts, opens, incorrect values, incorrect
> polarity etc. ICT is also referred to as Node Impedance Test (NIT).
> Modern ICT testers have many capabilities beyond just measuring
> impedance, such as boundary -scan and programming of non-volatile
> memory. Check also Agilent's testjet.
>
> Flying probe test is the prototype or low-volume version where the
> probes represent a very flexible fixture that can be programmed to hit
> all the nets in turn. ICT tester for higher volume will have a custom
> fixture for each board, with pogo-pins that connect to all nets
> simultaneously.
>
> Agilent and Teradyne are major vendors of in-circuit test equipment. You
> can check their websites for more information
>
> http://www.teradyne.com/
> http://www.home.agilent.com/
>
> Med vennlig hilsen. Best Regards.
> __________________________________________
> Haldor Husby
> Senior Development Engineer
> Data Respons Norge
>
> [log in to unmask]
> www.datarespons.no
>
>
>
> On Mon, 24 Jul 2006 21:43:54 +0100, ert ert <[log in to unmask]> wrote:
>
> >Hi All,
> >
> >I have studied and followed ICT testing on layout with constraint
> requirements like placing in grids, spacing b/w prope pads, component to
> Probe pads spacing,..etc But I do wish to know how the ICT testting is
> carried out? Is it similar to Bed of Nails test and Flying prope test?
> >
> >If any one has any documents or have practical experience on this can you
> help be understanding this.
> >
> >Thanks much in advance.
> >Nagaraj
>
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