Ramon, Bev, Dave,
Thank you very much.
The leads are tin plated. but I saw them only after soldering. I have to
check if I can get a new component from the same batch- but I can not be
sure that its leadframe will be from the same batch.
But how will we know if we get such components?
Do a solderability test for each batch?
I suppose that the leadfree rush caught a lot of component suppliers
unprepared, and I doubt that they all do tests on the leadframes they order.
Gaby
----- Original Message -----
From: "David D. Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 10, 2004 6:48 PM
Subject: Re: [TN] Tin plating on leads HELP!!!
> Hi Gaby! Do you know what the component lead surface finish is (what
> type/kind of plating)? Some plating types - like bright acid tin plating -
> could be the source of the solderballs. And yes, the 002B surface mount
> simulation test would be helpful in determining root cause.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
> Gabriela Bogdan
> <gabriela@NETVISI To: [log in to unmask]
> ON.NET.IL> cc:
> Sent by: TechNet Subject: [TN] Tin plating
on leads HELP!!!
> <[log in to unmask]>
>
>
> 09/10/2004 11:24
> AM
> Please respond to
> TechNet E-Mail
> Forum; Please
> respond to
> Gabriela Bogdan
>
>
>
>
>
>
> Dear friends,
> After assembly, on all circuits there was one fine pitch PLCC from a
> certain vendor which had lots of small solder balls between the leads,
even
> on the solder mask dam between them.
> Other PLCC's with the same pitch were clean.
> We tried to see the amount of solder balls by X-ray, and found many more
> behind the leads.
> At first we thought that our solder paste was the culprit, but seeing that
> other components were "normal" , we looked closer to the leads by X-ray,
> and saw a lot of small voids only along the leads of the bad component,
> these voids reaching to the upper end of the leads, where the solder paste
> did not reach. Visually, the upper part of the leads was very rough.
> I suppose that the tin plating of the leads contained additives which
epand
> during soldering, even burst out, and "spit" the molten solder all around.
> If this is the case,how could I reject such components during incoming
> inspection?
> Should I do a solderability test for each batch on a printed ceramic
plate?
> Gaby
>
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