Ramon, Bev, Dave, Thank you very much. The leads are tin plated. but I saw them only after soldering. I have to check if I can get a new component from the same batch- but I can not be sure that its leadframe will be from the same batch. But how will we know if we get such components? Do a solderability test for each batch? I suppose that the leadfree rush caught a lot of component suppliers unprepared, and I doubt that they all do tests on the leadframes they order. Gaby ----- Original Message ----- From: "David D. Hillman" <[log in to unmask]> To: <[log in to unmask]> Sent: Friday, September 10, 2004 6:48 PM Subject: Re: [TN] Tin plating on leads HELP!!! > Hi Gaby! Do you know what the component lead surface finish is (what > type/kind of plating)? Some plating types - like bright acid tin plating - > could be the source of the solderballs. And yes, the 002B surface mount > simulation test would be helpful in determining root cause. > > Dave Hillman > Rockwell Collins > [log in to unmask] > > > > Gabriela Bogdan > <gabriela@NETVISI To: [log in to unmask] > ON.NET.IL> cc: > Sent by: TechNet Subject: [TN] Tin plating on leads HELP!!! > <[log in to unmask]> > > > 09/10/2004 11:24 > AM > Please respond to > TechNet E-Mail > Forum; Please > respond to > Gabriela Bogdan > > > > > > > Dear friends, > After assembly, on all circuits there was one fine pitch PLCC from a > certain vendor which had lots of small solder balls between the leads, even > on the solder mask dam between them. > Other PLCC's with the same pitch were clean. > We tried to see the amount of solder balls by X-ray, and found many more > behind the leads. > At first we thought that our solder paste was the culprit, but seeing that > other components were "normal" , we looked closer to the leads by X-ray, > and saw a lot of small voids only along the leads of the bad component, > these voids reaching to the upper end of the leads, where the solder paste > did not reach. Visually, the upper part of the leads was very rough. > I suppose that the tin plating of the leads contained additives which epand > during soldering, even burst out, and "spit" the molten solder all around. > If this is the case,how could I reject such components during incoming > inspection? > Should I do a solderability test for each batch on a printed ceramic plate? > Gaby > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------