J-STD-001C requires a side joint 75% of the length of the foot of the
component, or width of the lead, which ever is less. There is no requirement
for fillet height. There are SOIC leads without solderable sides. They will
produce solder joints with evidence of wetting along the side but no
measurable fillet height.

Some SOIC packages do not provide enough stress relief, through the leads,
to perform well in harsh environments. If you are confident that the
component package is appropriate for your application, there is another
question. It sounds like your design will result in hidden solder
connections. There is a clause in the standard that establishes special
requirements in that situation. Do you rely on inspection to sort product?
Then, making it difficult to distinguish good from bad may be too risky. If
you use inspection to survey your operation and measure the quality of
product. It might not be a problem.


> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Malewicz Wesley
> Sent: Wednesday, June 09, 2004 2:31 PM
> To: [log in to unmask]
> Subject: [TN] Minimum side fillet for SOIC type components
>
> Hi,
>
> Is a side solder fillet for .025 pitch SOIC type components
> required? I
>
> need to run an exposed guard between pins for shielding
> sensitive nets and I
>
> would like to do this without having to go to a larger package. Any
>
> information on this or any reliability concerns, would be appreciated.
>
> Thank you,
>
> Wesley Malewicz
>
> Printed Circuit Development Supervisor
>
> DRAEGER MEDICAL
>
> Draeger Medical Systems, Inc
> 16 Electronics Avenue
> Danvers, MA 01923 USA
>
> Tel: +1 978-907-7776
> Fax: +1 978-907-6489
> E-mail: [log in to unmask]
> <mailto:[log in to unmask]>
>
> www.draeger-medical.com <http://www.draeger-medical.com/>
>

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