I agree with Guenter unless you are using SAC ball BGA and SnPb solder. In
that case we are, presently, stumped. The results of soldering at 210 to 220
are a little unpredictable. If you take the ball into reflow things look a
little better, but there is good cause for concern those old MSD ratings are
probably 2 levels off.

Ken

(1) No as long as you avoid Bi
(2) No
(3) Higher temperatures are only necessary if you use lead free solder
(4) Component manufacturers are changing their components now to be used for
lead free solder and hopefully will let you know. However, if you intend to
switch to lead free it is wise to start asking your supplier now about a
roadmap.
(5) European companies are starting now (and not too early). Many are at the
stage where they produce first pilot lots with lead free solder.


Best regards

Guenter



EMPA
Swiss Federal Laboratories  for Materials Testing and Research Centre for
Reliability Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Patel
> Sent: Tuesday, June 01, 2004 7:05 PM
> To: [log in to unmask]
> Subject: [TN] Impact of Mixed, Lead and Lead-free, components
> on assembly processes
>
> Dear Technetters,
>
> I have been informed by my engineering that many part
> manufacturers started providing list of EOL components (end
> of life) as they are switching to lead-free parts.
>
>
>
> As there will be a transition period from current PbSn
> process to lead-free process, I see the following phases.
>
> (a)    Lead components processed using eutectic solder (your current
> process).
>
> (b)    Mixed components (lead and lead-free) running using eutectic
> soldering process
>
> (c)    Mixed components (lead and lead-free) running using LEAD-FREE
> assembly process at CM.
>
> (d)    Lead-free components running on LEAD-FREE assembly processes.
>
>
>
> Based on above, I have the following primary concerns.
>
> (1)    Do you see any problem in processing mixed, lead and lead-free,
> components on a board?
>
> (2)    Will there be change in thermal profile when running lead-free
> components on PbSn process?
>
> (3)    If higher temperature is required then what is going
> to happen to
> lead processes component? They may not withstand the high temp.
>
> (4)    Should we ask for certificate from the lead component suppliers
> stating their lead parts can with stand higher temp?
>
> (5)    Are you preparing we imagine for lead-free processes
> in near future
> and when?
>
>
>
> Any help will be highly appreciated.
>
>
>
> Re,
>
> Ken Patel

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