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| Reply To: | TechNet E-Mail Forum. |
| Date: | Tue, 29 Jun 2004 08:08:30 +0300 |
| Content-Type: | text/plain |
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I recommend to try as a first priority to layout the via out of the BGA pad
(bump) to adjacent special micro via hole pad.
Up to 0.5 mils pitch it can be done.
The filling VIP is not 100% safe (solderability and voids aspects).
Best Regards
Reuven ROKAH
"Macko, Joe @
IEC" <joe.macko To: [log in to unmask]
Sent by: TechNet cc:
<[log in to unmask] Subject: Re: [TN] VIA in Pad
>
28/06/2004 17:35
Please respond
to "TechNet
E-Mail Forum.";
Please respond
to "Macko, Joe @
IEC"
Tom,
My experience has been that their generally a direct correlation between
voiding and VIP locations. Of course, the size of VIP has a direct bearing
on the potential size of the void in the solder ball ..... Our current
policy is to fill all VIPs to preclude any voiding problems or insufficient
solder conditions in leaded parts.
I would sensitize your customer to the potential for voiding which may not
meet IPC guidelines, and the need for rework with VIPs for leaded parts.
Good luck.
joe
-----Original Message-----
From: Tom Parkinson [mailto:[log in to unmask]]
Sent: Friday, June 25, 2004 8:20 AM
To: [log in to unmask]
Subject: [TN] VIA in Pad
We're a CM. One of our customers is asking us to build a board assembly
that will be using BGAs with VIAs in pads. They are in the design stages
at
this point, and we have some concerns with having a Via in the middle of a
BGA pad. Anyone have suggestions and/or experience with this??
Thanks
Tom Parkinson - Quality System Manager - CIT
WinTronics, Inc.
Ph: 724-981-5770 Ext. 235
Fax: 724-981-1772
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