Tom,

My experience has been that their generally a direct correlation between
voiding and VIP locations.  Of course, the size of VIP has a direct bearing
on the potential size of the void in the solder ball .....  Our current
policy is to fill all VIPs to preclude any voiding problems or insufficient
solder conditions in leaded parts.

I would sensitize your customer to the potential for voiding which may not
meet IPC guidelines, and the need for rework with VIPs for leaded parts.
Good luck.

joe

-----Original Message-----
From: Tom Parkinson [mailto:[log in to unmask]]
Sent: Friday, June 25, 2004 8:20 AM
To: [log in to unmask]
Subject: [TN] VIA in Pad


We're a CM.  One of our customers is asking us to build a board assembly
that will be using BGAs with VIAs in pads.  They are in the design stages at
this point, and we have some concerns with having a Via in the middle of a
BGA pad.  Anyone have suggestions and/or experience with this??



Thanks





Tom Parkinson - Quality System Manager - CIT

WinTronics, Inc.

Ph: 724-981-5770 Ext. 235

Fax: 724-981-1772






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