Plugging with conductive hole fill has been very successful for one of our
Customers.  We suggested that they go to that process after we experienced a
large fallout and discovered that during the Surface mount process we had
outgassing of the vias.  Some of the vias were very close together and under
large components thus we ended up with solder shorts under the components
that were not visible.  After the change we experienced nearly a 100% yield.
The conductive hole fill that was utilized was CB100.  I gave my Cusotmer
the option of non-conductive which was cheaper however they chose the
conductive.  The conductive also protects against any other plating problems
that may exist in the via hole.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Tom Parkinson
Sent: Friday, June 25, 2004 8:14 AM
To: [log in to unmask]
Subject: [TN] VIA in Pad


We're a CM.  One of our customers is asking us to build a board assembly
that will be using BGAs with VIAs in pads.  They are in the design stages at
this point, and we have some concerns with having a Via in the middle of a
BGA pad.  Anyone have suggestions and/or experience with this??

Thanks


Tom Parkinson - Quality System Manager - CIT
WinTronics, Inc.
Ph: 724-981-5770 Ext. 235
Fax: 724-981-1772


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