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June 2004

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Subject:
ENIG and flaking mask
From:
Kathy Bergman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Jun 2004 17:14:13 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
Hello Tech Netters,

Has anyone dealt with the following condition:

Bare boards are ENIG, several SMT pads within wide traces. After ENIG,
soldermask is peeling from copper on the traces, at the junction of the ENIG
and mask. We have eliminated any mask failure possibilities. What, if
anything in the ENIG process (or error in the process) would compromise the
soldermask adhesion and lift it from the copper?

Any help will be appreciated.

K Bergman

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